VIA showed off its Eden X2 dual-core processor today at the Embedded World 2011 exhibition. It's a x86 chip optimized for fanless implementations in embedded applications, both industrial and commercial. Despite the lack of active cooling, VIA backs the new chip with a 7-year longevity guarantee.
"Eden X2 shows how once again VIA is setting the pace when it comes to highly optimized, power-efficient processing," said Daniel Wu, Vice President, VIA Embedded Platform Division, VIA. "Embedded developers will relish the opportunity to integrate a native 64-bit, dual-core processor in passively cooled, ultra stable systems."
Eden X2 is built on a 40nm manufacturing processor using a VIA NanoBGA2 package measuring 21mm x 21mm with a die size of 11mm x 6mm. Key features include native support for 64-bit OSes, high-performance superscalar processing, AES hardware encryption, virtualization technology, and pin-to-pin compatibility with VIA Eden, C7, and Nano-E series processors.
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"Eden X2 shows how once again VIA is setting the pace when it comes to highly optimized, power-efficient processing," said Daniel Wu, Vice President, VIA Embedded Platform Division, VIA. "Embedded developers will relish the opportunity to integrate a native 64-bit, dual-core processor in passively cooled, ultra stable systems."
Eden X2 is built on a 40nm manufacturing processor using a VIA NanoBGA2 package measuring 21mm x 21mm with a die size of 11mm x 6mm. Key features include native support for 64-bit OSes, high-performance superscalar processing, AES hardware encryption, virtualization technology, and pin-to-pin compatibility with VIA Eden, C7, and Nano-E series processors.
More...